November 14, 2022
EECS Professor Shijia Pan was awarded the best demo award at the Conference on Embedded Networked Sensor Systems (SenSys 2022) held in November. The demo abstract titled, "MOOCA: Miura-Ori Origami-Based Configurable Shelf-Liner for Autonomous Retail," is a project supported by AiFi Inc. to build a low-cost elastic sensor inspired by origami – the Japanese paper folding structure. Authors include Pan, Shubham Rohal and Yue Zhang from UC Merced and Carlos Ruiz from AiFi Inc.
