November 14, 2022
![](https://news.ucmerced.edu/sites/news.ucmerced.edu/files/shijia_pan.jpg)
EECS Professor Shijia Pan was awarded the best demo award at the Conference on Embedded Networked Sensor Systems (SenSys 2022) held in November. The demo abstract titled, "MOOCA: Miura-Ori Origami-Based Configurable Shelf-Liner for Autonomous Retail," is a project supported by AiFi Inc. to build a low-cost elastic sensor inspired by origami – the Japanese paper folding structure. Authors include Pan, Shubham Rohal and Yue Zhang from UC Merced and Carlos Ruiz from AiFi Inc.